- Low
- 98,036
- Average
- 104,587
- Median
- 104,587
- High
- 111,138
Micron Technology Advanced Packaging R&d Die Stacking & Die Attach Engineer Salary
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Micron Technology Advanced Packaging R&d Die Stacking & Die Attach Engineer average salary is $104,587, median salary is $104,587 with a salary range from $98,036 to $111,138.
Micron Technology Advanced Packaging R&d Die Stacking & Die Attach Engineer salaries are collected from government agencies and companies. Each salary is associated with a real job position. Micron Technology Advanced Packaging R&d Die Stacking & Die Attach Engineer salary statistics is not exclusive and is for reference only. They are presented "as is" and updated regularly.
Micron Technology Advanced Packaging R&d Die Stacking & Die Attach Engineer salaries are collected from government agencies and companies. Each salary is associated with a real job position. Micron Technology Advanced Packaging R&d Die Stacking & Die Attach Engineer salary statistics is not exclusive and is for reference only. They are presented "as is" and updated regularly.
| Jobtitle | Company | Salary | City | Year |
| Advanced Packaging R&d Die Stacking & Die Attach Engineer | Micron Technology | $ 111,138 | Boise, ID, 83701 | 10/01/2015 |
| Advanced Packaging R&d Die Stacking & Die Attach Engineer | Micron Technology | $ 98,036 | Boise, ID, 83701 | 09/01/2016 |
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Micron Technology Advanced Packaging R&d Die Stacking & Die Attach Engineer salary is full-time annual starting salary. Intern, contractor and hourly pay scale vary from regular exempt employee. Compensation depends on work experience, job location, bonus, benefits and other factors.
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