- Low
- 80,000
- Average
- 86,474
- Median
- 87,422
- High
- 92,000
Substrate Design Engineer (ic Packaging) Salary
57
13
79
Substrate Design Engineer (ic Packaging) average salary is $86,474, median salary is $87,422 with a salary range from $80,000 to $92,000.
Substrate Design Engineer (ic Packaging) salaries are collected from government agencies and companies. Each salary is associated with a real job position. Substrate Design Engineer (ic Packaging) salary statistics is not exclusive and is for reference only. They are presented "as is" and updated regularly.
Substrate Design Engineer (ic Packaging) salaries are collected from government agencies and companies. Each salary is associated with a real job position. Substrate Design Engineer (ic Packaging) salary statistics is not exclusive and is for reference only. They are presented "as is" and updated regularly.
| Company | Salaries | City | Year | More info |
| Seabury Consulting | 87,422-87,422 | San Jose, CA, 95101 | 2016 | Seabury Consulting Substrate Design Engineer (ic Packaging) Salaries (3) Substrate Design Engineer (ic Packaging) San Jose, CA Salaries |
| Seabury Consulting | 92,000-92,000 | San Diego, CA, 92101 | 2013 | Seabury Consulting Substrate Design Engineer (ic Packaging) Salaries (3) Substrate Design Engineer (ic Packaging) San Diego, CA Salaries |
| Seabury Consulting | 80,000-80,000 | San Jose, CA, 95101 | 2013 | Seabury Consulting Substrate Design Engineer (ic Packaging) Salaries (3) Substrate Design Engineer (ic Packaging) San Jose, CA Salaries |
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Substrate Design Engineer (ic Packaging) salary is full-time annual starting salary. Intern, contractor and hourly pay scale vary from regular exempt employee. Compensation depends on work experience, job location, bonus, benefits and other factors.
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生化专利代理人/生化专利工程师工资专利代理师（苏州）工资机械方向专利代理师/代理师助理工资 Substrate Design Engineer (... Jobs
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