- Low
- 85,519
- Average
- 108,801
- Median
- 108,801
- High
- 132,082
Micron Technology Lead R&d Package Technology Integration Engineer Salary
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Micron Technology Lead R&d Package Technology Integration Engineer average salary is $108,801, median salary is $108,801 with a salary range from $85,519 to $132,082.
Micron Technology Lead R&d Package Technology Integration Engineer salaries are collected from government agencies and companies. Each salary is associated with a real job position. Micron Technology Lead R&d Package Technology Integration Engineer salary statistics is not exclusive and is for reference only. They are presented "as is" and updated regularly.
Micron Technology Lead R&d Package Technology Integration Engineer salaries are collected from government agencies and companies. Each salary is associated with a real job position. Micron Technology Lead R&d Package Technology Integration Engineer salary statistics is not exclusive and is for reference only. They are presented "as is" and updated regularly.
| Jobtitle | Company | Salary | City | Year |
| Lead R&d Package Technology Integration Engineer | Micron Technology | $ 85,519 | Boise, ID, 83701 | 08/15/2017 |
| Lead R&d Package Technology Integration Engineer | Micron Technology | $ 132,082 | Boise, ID, 83701 | 08/15/2018 |
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Micron Technology Lead R&d Package Technology Integration Engineer salary is full-time annual starting salary. Intern, contractor and hourly pay scale vary from regular exempt employee. Compensation depends on work experience, job location, bonus, benefits and other factors.
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