Micron Technology R&d Packaging Engineer Salary

Micron Technology R&d Packaging Engineer average salary is $72,500, median salary is $72,500 with a salary range from $72,500 to $72,500.
Micron Technology R&d Packaging Engineer salaries are collected from government agencies and companies. Each salary is associated with a real job position. Micron Technology R&d Packaging Engineer salary statistics is not exclusive and is for reference only. They are presented "as is" and updated regularly.

Low: 72,500

Average: 72,500

Median: 72,500

High: 72,500

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Jobtitle	Company	Salary	City	Year
R&d Packaging Engineer	Micron Technology	$ 72,500	Boise, ID, 83701	07/02/2012

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Micron Technology R&d Packaging Engineer salary is full-time annual starting salary. Intern, contractor and hourly pay scale vary from regular exempt employee. Compensation depends on work experience, job location, bonus, benefits and other factors.

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