- Low
- 22,880
- Average
- 79,523
- Median
- 75,000
- High
- 893,444
Advanced Packaging R&d Die Stacking & Die Attach Engineer Boise, ID Salary
26
71
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Advanced Packaging R&d Die Stacking & Die Attach Engineer Boise, ID average salary is $79,523, median salary is $75,000 with a salary range from $22,880 to $893,444.
Advanced Packaging R&d Die Stacking & Die Attach Engineer Boise, ID salaries are collected from government agencies and companies. Each salary is associated with a real job position. Advanced Packaging R&d Die Stacking & Die Attach Engineer Boise, ID salary statistics is not exclusive and is for reference only. They are presented "as is" and updated regularly.
Advanced Packaging R&d Die Stacking & Die Attach Engineer Boise, ID salaries are collected from government agencies and companies. Each salary is associated with a real job position. Advanced Packaging R&d Die Stacking & Die Attach Engineer Boise, ID salary statistics is not exclusive and is for reference only. They are presented "as is" and updated regularly.
| Jobtitle | Company | Salary | City | Year |
| Advanced Packaging R&d Die Stacking & Die Attach Engineer | Micron Technology | $ 111,138 | Boise, ID, 83701 | 10/01/2015 |
| Advanced Packaging R&d Die Stacking & Die Attach Engineer | Micron Technology | $ 98,036 | Boise, ID, 83701 | 09/01/2016 |
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Advanced Packaging R&d Die Stacking & Die Attach Engineer Boise, ID salary is full-time annual starting salary. Intern, contractor and hourly pay scale vary from regular exempt employee. Compensation depends on work experience, job location, bonus, benefits and other factors.
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