- Low
- 20,800
- Average
- 81,693
- Median
- 74,173
- High
- 1,164,086
Advanced Packaging Design Engineer Chicago, IL Salary
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Advanced Packaging Design Engineer Chicago, IL average salary is $81,693, median salary is $74,173 with a salary range from $20,800 to $1,164,086.
Advanced Packaging Design Engineer Chicago, IL salaries are collected from government agencies and companies. Each salary is associated with a real job position. Advanced Packaging Design Engineer Chicago, IL salary statistics is not exclusive and is for reference only. They are presented "as is" and updated regularly.
Advanced Packaging Design Engineer Chicago, IL salaries are collected from government agencies and companies. Each salary is associated with a real job position. Advanced Packaging Design Engineer Chicago, IL salary statistics is not exclusive and is for reference only. They are presented "as is" and updated regularly.
| Jobtitle | Company | Salary | City | Year |
| Advanced Packaging Design Engineer | Wellspring Worldwide | $ 104,000 | CHICAGO, IL, 60654 | 03/06/2017 |
| Advanced Packaging Design Engineer | Wellspring Worldwide | $ 104,000 | CHICAGO, IL, 60654 | 04/01/2018 |
| Advanced Packaging Design Engineer | Wellspring Worldwide | $ 104,000 | CHICAGO, IL, 60654 | 04/01/2018 |
| Advanced Packaging Design Engineer | Wellspring Worldwide | $ 104,000 | CHICAGO, IL, 60654 | 04/01/2018 |
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Advanced Packaging Design Engineer Chicago, IL salary is full-time annual starting salary. Intern, contractor and hourly pay scale vary from regular exempt employee. Compensation depends on work experience, job location, bonus, benefits and other factors.
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