- Low
- 93,900
- Average
- 101,244
- Median
- 101,244
- High
- 108,588
Micron Technology Plasma Etch Process Development Engineer Salary
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46
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Micron Technology Plasma Etch Process Development Engineer average salary is $101,244, median salary is $101,244 with a salary range from $93,900 to $108,588.
Micron Technology Plasma Etch Process Development Engineer salaries are collected from government agencies and companies. Each salary is associated with a real job position. Micron Technology Plasma Etch Process Development Engineer salary statistics is not exclusive and is for reference only. They are presented "as is" and updated regularly.
Micron Technology Plasma Etch Process Development Engineer salaries are collected from government agencies and companies. Each salary is associated with a real job position. Micron Technology Plasma Etch Process Development Engineer salary statistics is not exclusive and is for reference only. They are presented "as is" and updated regularly.
| Jobtitle | Company | Salary | City | Year |
| Plasma Etch Process Development Engineer | Micron Technology | $ 93,900 | Boise, ID, 83701 | 08/16/2012 |
| Plasma Etch Process Development Engineer | Micron Technology | $ 108,588 | Boise, ID, 83701 | 08/16/2015 |
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Micron Technology Plasma Etch Process Development Engineer salary is full-time annual starting salary. Intern, contractor and hourly pay scale vary from regular exempt employee. Compensation depends on work experience, job location, bonus, benefits and other factors.
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